Maleville, Christoph: search on Z-Library

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1

Ultra-thin body & buried oxide SOI substrate development and qualification for Fully Depleted SOI device with back bias capability

Schwarzenbach, Walter, Nguyen, Bich-Yen, Allibert, Frederic, Girard, Christophe, Maleville, Christophe

Journal:

Solid-State Electronics

Year:

2016

Language:

english

File:

PDF, 2.33 MB

english, 2016

2

High Temperature RTP Application in SOI Manufacturing

Maleville, Christophe, Neyret, Eric, Delprat, Daniel, Ecarnot, Ludovic

Journal:

Materials Science Forum

Year:

2008

Language:

english

File:

PDF, 1.92 MB

english, 2008

3

ECS Transactions [ECS 219th ECS Meeting - Montreal, QC, Canada (May 1 - May 6, 2011)] - Ultra-Thin Film SOI/BOX Substrate Development, Its Application and Readiness

Schwarzenbach, Walter, Cauchy, Xavier, Bonnin, Olivier, Daval, Nicolas, Aulnette, Cécile, Girard, Christophe, Nguyen, Bich-Yen, Maleville, Christophe

Year:

2011

Language:

english

File:

PDF, 480 KB

english, 2011

4

[ECS 210th ECS Meeting - Cancun, Mexico (October 29-November 3, 2006)] ECS Transactions - SOI Material Readiness for 45nm and Sub-45nm Device Options

Maleville, Christophe

Year:

2006

Language:

english

File:

PDF, 869 KB

english, 2006

5

[IEEE 2009 IEEE International SOI Conference - Foster City, CA, USA (2009.10.5-2009.10.8)] 2009 IEEE International SOI Conference - SOI substrate readiness for 22/20 nm and for fully depleted planar device architectures

Delprat, Daniel, Boedt, Francois, David, Carole, Reynaud, Patrick, Alami-Idrissi, Aziz, Landru, Didier, Girard, Christophe, Maleville, Christophe

Year:

2009

Language:

english

File:

PDF, 1.93 MB

english, 2009

6

Smart-Cut® technology: from 300 mm ultrathin SOI production to advanced engineered substrates

Christophe Maleville, Carlos Mazuré

Journal:

Solid-State Electronics

Year:

2004

Language:

english

File:

PDF, 691 KB

english, 2004

7

[IEEE 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Xian, China (2012.10.29-2012.11.1)] 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology - Substrate engineering using Smart CutTM and Smart StackingTM for next-generation advanced LSIs

Yoshimi, Makoto, Cauchy, Xavier, Desbonnets, Eric, Radu, Ionut, Maleville, Christophe

Year:

2012

Language:

english

File:

PDF, 552 KB

english, 2012

8

[IEEE 2015 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - Rohnert Park, CA, USA (2015.10.5-2015.10.8)] 2015 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - Engineered substrates for Moore and more than Moore's law: Device scaling: Entering the substrate era

Maleville, Christophe

Year:

2015

Language:

english

File:

PDF, 488 KB

english, 2015

9

[IEEE 2011 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) - Hsinchu, Taiwan (2011.04.25-2011.04.27)] Proceedings of 2011 International Symposium on VLSI Technology, Systems and Applications - Extending planar device roadmap beyond node 20nm through ultra thin body technology

Maleville, Christophe

Year:

2011

Language:

english

File:

PDF, 226 KB

english, 2011

10

Highly Scaled Strained Silicon-On-Insulator Technology for the 5G Era: Impact of Geometry and Annealing on Strain Retention and Device Performance of nMOSFETs

Kong, Eugene Y.-J., Yadav, Sachin, Lei, Dian, Kang, Yuye, Sivan, Maheswari, Li, Yida, Nguyen, Bich-Yen, Schwarzenbach, Walter, Ecarnot, Ludovic, Sellier, Manuel, Maleville, Christophe, Thean, Aaron V.

Journal:

IEEE Transactions on Electron Devices

Year:

2019

Language:

english

File:

PDF, 3.64 MB

english, 2019

11

Smart-Cut Process for Ultrathin SOI Wafers Manufacturing

Maleville, Christophe

Journal:

Solid State Phenomena

Year:

2004

Language:

english

File:

PDF, 993 KB

english, 2004

12

Direct Wafer Bonding for Nanostructure Preparations

Moriceau, Hubert, Rieutord, F., Morales, C., Charvet, A.M., Rayssac, O., Bataillou, B., Fournel, F., Eymery, J., Pascale, A., Gentile, P., Bavard, A., Mézière, J., Maleville, Christophe, Aspar, B.

Journal:

Solid State Phenomena

Year:

2007

Language:

english

File:

PDF, 865 KB

english, 2007

13

A Path to Energy Efficiency and Reliability for ICs: Fully Depleted Silicon-on-Insulator (FD-SOI) Devices Offer Many Advantages

Nguyen, Bich-Yen, Flatresse, Philippe, Schaeffer, Jamie, Arnaud, Franck, Mhira, Souhir, Huart, Vincent, Weber, Olivier, Sellier, Manuel, Maleville, Christophe

Journal:

IEEE Solid-State Circuits Magazine

Year:

2018

Language:

english

File:

PDF, 4.94 MB

english, 2018

14

Wafer bonding and H-implantation mechanisms involved in the Smart-cut® technology

Christophe Maleville, B. Aspar, T. Poumeyrol, H. Moriceau, M. Bruel, A.J. Auberton-Hervè, T. Barge

Journal:

Materials Science and Engineering: B

Year:

1997

Language:

english

File:

PDF, 553 KB

english, 1997

15

(Keynote) Low Temperature SmartCut TM Process for 3D Integration

Schwarzenbach, Walter, Reboh, Shay, Ghorbel, Aymen, Gaudin, Gweltaz, Besnard, Guillaume, Mazen, FrÃ©dÃ©ric, Loup, Virginie, Maitrejean, Sylvain, Brunet, Laurent, Nguyen, Bich-Yen, Maleville, Christoph

Journal:

ECS Transactions

Year:

2020

File:

PDF, 575 KB

2020

16

[IEEE 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Shanghai, China (2010.11.1-2010.11.4)] 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology - Ultra-thin SOI wafer technologies for 22/20nm CMOS or beyond

Yoshimi, Makoto, Cauchy, Xavier, Maleville, Christophe

Year:

2010

Language:

english

File:

PDF, 445 KB

english, 2010

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